The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Feb. 11, 2016
Applicant:

First Solar Malaysia Sdn. Bhd., Kulim, MY;

Inventors:

Bastiaan Arie Korevaar, Schenectady, NY (US);

Jinbo Cao, Rexford, NY (US);

Adam Fraser Halverson, Niskayuna, NY (US);

Scott Daniel Feldman-Peabody, Golden, CO (US);

Mark Jeffrey Pavol, Arvada, CO (US);

Douglas Garth Jensen, Lakewood, CO (US);

Assignee:

FIRST SOLAR, INC., Tempe, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0392 (2006.01); H01L 31/048 (2014.01); H01L 31/073 (2012.01);
U.S. Cl.
CPC ...
H01L 31/1864 (2013.01); H01L 31/03925 (2013.01); H01L 31/048 (2013.01); H01L 31/073 (2013.01); H01L 31/18 (2013.01); H01L 31/1828 (2013.01); Y02E 10/543 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method of processing a semiconductor assembly is presented. The method includes fabricating a photovoltaic module including a semiconductor assembly. The fabrication step includes performing an efficiency enhancement treatment on the semiconductor assembly, wherein the efficiency enhancement treatment includes light soaking the semiconductor assembly, and heating the semiconductor assembly. The semiconductor assembly includes a window layer having an average thickness less than about 80 nanometers, wherein the window layer includes cadmium and sulfur. A related system is also presented.


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