The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Oct. 14, 2015
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Makoto Agatani, Osaka, JP;

Toshio Hata, Osaka, JP;

Tomokazu Nada, Osaka, JP;

Shinya Ishizaki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/50 (2006.01); H01L 51/52 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); F21K 99/00 (2016.01); H05K 1/11 (2006.01); F21V 23/06 (2006.01); H01L 33/54 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); F21Y 101/02 (2006.01); F21Y 105/00 (2016.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); F21K 9/00 (2013.01); F21V 23/06 (2013.01); H01L 33/483 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H05K 1/11 (2013.01); F21K 9/135 (2013.01); F21Y 2101/02 (2013.01); F21Y 2105/001 (2013.01); H01L 33/52 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/01327 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/094 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.


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