The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Aug. 15, 2014
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Cheol Ho Joh, Icheon-si, KR;
SK HYNIX INC., Icheon-Si, KR;
Abstract
The semiconductor package includes: a substrate having a window and first and second bond fingers arranged over a first surface along a periphery of the window; a first semiconductor chip disposed within the window and having a plurality of first bonding pads arranged over edges of an upper surface; a plurality of first connection members electrically coupling the first bonding pads with the first bonding fingers; a second semiconductor chip disposed over the first semiconductor chip and the first surface of the substrate and a plurality of second bonding pads in the edges of the lower surface; a plurality of second connection members electrically coupling the second bonding pads with the second bonding fingers of the substrate adjacent to the second bonding pads; and an encapsulation member formed over the first surface of the substrate to cover side surfaces of the second semiconductor chip.