The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jan. 19, 2015
Applicants:

Kunihito Kato, Nisshin, JP;

Shuhei Oki, Nagakute, JP;

Takahiro Ito, Toyota, JP;

Inventors:

Kunihito Kato, Nisshin, JP;

Shuhei Oki, Nagakute, JP;

Takahiro Ito, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/265 (2006.01); H01L 21/683 (2006.01); H01L 21/263 (2006.01); H01L 29/32 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 21/265 (2013.01); H01L 21/263 (2013.01); H01L 21/26506 (2013.01); H01L 21/6835 (2013.01); H01L 29/32 (2013.01); H01L 29/66348 (2013.01); H01L 29/7397 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A method includes: forming a front surface structure of a semiconductor element on a front surface side of a semiconductor substrate; forming crystal defects in the semiconductor substrate by implanting charged particles into the semiconductor substrate; subjecting the semiconductor substrate to a heat treatment after having formed the crystal defects; attaching a supporting plate on the front surface side of the semiconductor substrate after the heat treatment; thinning the semiconductor substrate by grinding a back surface side of the semiconductor substrate to which the supporting plate has been attached; and forming a back surface structure of the semiconductor element on a back surface of the thinned semiconductor substrate.


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