The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

May. 20, 2011
Applicants:

Yousuke Endo, Kitaibaraki, JP;

Takamasa Maekawa, Kitaibaraki, JP;

Inventors:

Yousuke Endo, Kitaibaraki, JP;

Takamasa Maekawa, Kitaibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C25B 11/00 (2006.01); C25B 13/00 (2006.01); H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/14 (2006.01); C22F 1/16 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3426 (2013.01); C22F 1/16 (2013.01); C23C 14/14 (2013.01); C23C 14/3414 (2013.01);
Abstract

Provided are an indium target capable of achieving a high deposition rate while suppressing the occurrence of arcing, and a method for manufacturing the indium target. In the process of solidification at the time of melting and casting an indium ingot, ultrasonic vibration is applied to molten indium liquid which is at least in a state immediately before solidification, and thereby, coarsening of the grain size is suppressed. Thus, an indium target is provided An indium target in which an overall average grain size is 10 mm or less; for the grains observed from a cross-section parallel to a thickness direction, a ratio of an average grain size in a direction parallel to the thickness direction with respect to an average grain size in a direction perpendicular to the thickness direction is 0.7 to 1.1; and pores with a pore size of 50 μm or greater exists at a density of 1 pore/cmor less.


Find Patent Forward Citations

Loading…