The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jan. 14, 2011
Applicants:

Ted Kluska, Madison, AL (US);

Donald Folker, Madison, AL (US);

Deborah Pinkerton, Madison, AL (US);

Inventors:

Ted Kluska, Madison, AL (US);

Donald Folker, Madison, AL (US);

Deborah Pinkerton, Madison, AL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/08 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/22 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 27/08 (2013.01); H01F 27/322 (2013.01);
Abstract

A magnetic component for an electronic circuit includes a core having one or more core surface grooves defined on a side wall, an end wall or both, along the outer core perimeter. Each core surface groove can improve heat flux away from the magnetic component. In some embodiments, a thermally conductive gap filler material is disposed adjacent one or more of the core surface grooves. An electronic device includes a magnetic component with one or more core surface grooves positioned on a circuit board inside an enclosure. The gap filler material spans a gap between the magnetic component and an enclosure wall interior surface, thereby providing a thermal bridge between the component and the enclosure facilitating heat flux away from the core to the enclosure wall.


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