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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9488675 B1

PDFFull Text
Date of Patent:
Nov. 08, 2016

Filed:

Apr. 03, 2013

Test socket having high-density conductive unit, and method for manufacturing same

Applicant:

Isc Co., Ltd., Seongnam-si, Gyeonggi-do, KR;

Inventor:

Jae Hak Lee, Seongnam-si, KR;

Assignee:

ISC CO., LTD., Seongnam-si, Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Jermele M Hollington

Assistant Examiner:

Zannatul Ferdous

Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 3/00 (2006.01); H01R 43/00 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
G01R 1/0441 (2013.01); G01R 1/0466 (2013.01); G01R 1/0483 (2013.01); G01R 1/07314 (2013.01); G01R 3/00 (2013.01); H01R 12/714 (2013.01); H01R 13/2414 (2013.01); H01R 43/002 (2013.01); H01R 12/73 (2013.01);
Abstract

The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, whereby an elastic conductive sheet is arranged at a position corresponding to the terminal of the device, and includes a first conductive unit arranged in the thickness direction of an elastic material and an insulating support unit for supporting the first conductive unit. A support sheet is attached to the elastic conductive sheet and has through-holes corresponding to the terminal of the device. A second conductive unit is arranged in the through-holes of the support sheet in the thickness direction in an elastic material.

Find Patent Forward Citations

Lee, Jae. (2016). Test socket having high-density conductive unit, and method for manufacturing same (U.S. Patent No. 9488675). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9488675

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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