The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jun. 04, 2015
Applicant:

Samco Inc., Kyoto-shi, Kyoto, JP;

Inventors:

Kiyoshi Hasegawa, Otokuni-gun, JP;

Hiroshi Kawamura, Kyoto, JP;

Peter Wood, San Jose, CA (US);

Assignee:

SAMCO INC., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/55 (2014.01); G01J 1/02 (2006.01); G01J 1/42 (2006.01); G01N 21/84 (2006.01);
U.S. Cl.
CPC ...
G01J 1/0238 (2013.01); G01J 1/4257 (2013.01); G01N 21/55 (2013.01); G01N 2021/8427 (2013.01); G01N 2201/025 (2013.01); G01N 2201/1087 (2013.01);
Abstract

The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrumentincludes an optical axis tilting mechanismthat includes a first tilting mechanismand a second tilting mechanism. From the optical axis Aof irradiation light beam emitted from a light beam source, the first tilting mechanismtilts the optical axis Aabout the first tilting axis T. The second tilting mechanismtilts the optical axis Aabout the second tilting axis T. The light beam measuring instrumentcan receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanismeven if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.


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