The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jul. 08, 2014
Applicant:

Chaun-choung Technology Corp., New Taipei, TW;

Inventors:

Shih-Ming Wang, New Taipei, TW;

Pang-Hung Liao, New Taipei, TW;

Cheng-Tu Wang, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0233 (2013.01); B23P 15/26 (2013.01); F28D 15/0275 (2013.01); F28D 15/0283 (2013.01);
Abstract

A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.


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