The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Oct. 25, 2013
Applicant:

Baker Hughes Incorporated, Houston, TX (US);

Inventors:

Edward T. Wood, Kingwood, TX (US);

David P. Gerrard, Montgomery, TX (US);

Joshua C. Falkner, Richmond, TX (US);

Ramon R. Garza, Pearland, TX (US);

Assignee:

Baker Hughes Incorporated, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 33/124 (2006.01); E21B 41/00 (2006.01); E21B 33/00 (2006.01); E21B 34/06 (2006.01);
U.S. Cl.
CPC ...
E21B 33/124 (2013.01); E21B 33/00 (2013.01); E21B 41/00 (2013.01); E21B 34/06 (2013.01);
Abstract

A pressure compensation system for enclosed spaces at a subterranean location changes volume with thermally induced solubility changes of a salt in water. The salt is held in an enclosure that is either rigid, or impervious and flexible or porous and flexible. As well conditions change and temperature increases, some of the salt goes into solution with a resulting decrease in volume that compensates for thermally induced volume increase due to temperature increase in the borehole. Conversely, a decrease in borehole temperature brings some of the salt out of solution for a volume increase to offset the volume decrease of the adjacent fluid to keep the pressure stabilized in the enclosed volume. In the porous enclosure embodiment the openings are sufficiently small to retain the salt even in solution. However, minimal net flows are anticipated for pressure compensation due to changing thermal effects.


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