The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Feb. 11, 2011
Applicant:

Matthew S. Walp, Ann Arbor, MI (US);

Inventor:

Matthew S. Walp, Ann Arbor, MI (US);

Assignee:

Guardian Industries Corp., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); C03C 17/04 (2006.01); C03C 17/36 (2006.01); B23K 26/32 (2014.01); B23K 26/00 (2014.01); B23K 26/34 (2014.01); C03C 17/34 (2006.01); B23K 35/365 (2006.01);
U.S. Cl.
CPC ...
C03C 17/04 (2013.01); B23K 26/0063 (2013.01); B23K 26/32 (2013.01); B23K 26/324 (2013.01); B23K 26/3273 (2013.01); B23K 26/3293 (2013.01); B23K 26/34 (2013.01); B23K 35/365 (2013.01); C03C 17/34 (2013.01); C03C 17/366 (2013.01); B23K 2201/18 (2013.01); B23K 2203/50 (2015.10); C03C 2217/72 (2013.01); Y10T 29/49885 (2015.01); Y10T 428/24851 (2015.01);
Abstract

Certain example embodiments relate to substrates or assemblies having laser-fused frits, and/or methods of making the same. In certain example embodiments, a pattern is formed or written on a stock glass sheet by laser fusing frit material to the glass sheet. An optional thin film coating is disposed on and supported by the stock glass sheet. The stock glass sheet with the pattern and the optional thin film coating is cut prior to heat treatment (e.g., heat strengthening and/or thermal tempering). A YAG or other type of laser source may be used to directly or indirectly heat the frit material, which may be wet applied to the substrate. In certain instances, the laser firing of the frit raises the temperature of the glass substrate to no more than 100 degrees C. and, preferably, the temperature is kept even lower.


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