The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jun. 21, 2013
Applicant:
Nextinput, Inc., Atlanta, GA (US);
Inventor:
Amnon Brosh, Santa Monica, CA (US);
Assignee:
NextInput, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01L 1/04 (2006.01); G01L 1/18 (2006.01); G01L 5/00 (2006.01); G01L 5/16 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); B81C 1/00666 (2013.01); G01L 1/044 (2013.01); G01L 1/18 (2013.01); G01L 5/0028 (2013.01); G01L 5/0057 (2013.01); G01L 5/162 (2013.01);
Abstract
Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.