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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9486956 B1

PDFFull Text
Date of Patent:
Nov. 08, 2016

Filed:

May. 01, 2014

Power adapter components, housing and methods of assembly

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Cesar Lozano Villarreal, Santa Clara, CA (US);

Alexander M. Kwan, Los Altos Hills, CA (US);

Kevin A. Oberther, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:

Kilpatrick Townsend & Stockton LLP

Primary Examiner:

Thanh Tam Le

Int. Cl.
CPC ...
H01R 13/66 (2006.01); B29C 65/56 (2006.01); B29C 65/08 (2006.01); B29C 65/00 (2006.01); H01R 13/504 (2006.01); H01R 13/655 (2006.01); H01R 43/02 (2006.01); H01F 27/28 (2006.01); H01F 27/30 (2006.01); B29L 31/34 (2006.01); H01R 31/06 (2006.01);
U.S. Cl.
CPC ...
B29C 65/565 (2013.01); B29C 65/08 (2013.01); B29C 65/081 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/244 (2013.01); B29C 66/542 (2013.01); B29C 66/81419 (2013.01); B29C 66/8322 (2013.01); B29C 66/8432 (2013.01); H01F 27/2804 (2013.01); H01F 27/306 (2013.01); H01R 13/5045 (2013.01); H01R 13/655 (2013.01); H01R 43/0207 (2013.01); B29C 66/71 (2013.01); B29C 66/9512 (2013.01); B29C 66/9513 (2013.01); B29L 2031/3481 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01); H01R 31/065 (2013.01); Y10T 29/49915 (2015.01);
Abstract

A dual-purpose transformer may be oriented in a plane perpendicular to planes in which printed circuit boards connected thereto are oriented, thereby providing structural support for a framework that can include a dense arrangement of internal power adapter components, in addition to stepping down voltage. Methods for ultrasonic welding are also provided and may be used to concurrently assemble, join and press-fit power adapter housing components. A ground lug is also provided that is shaped and located within a cover piece of a power adapter housing to allow for blind mating with a printed circuit board during an assembly process.

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