The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Oct. 20, 2014
Viasystems Technologies Corp., Llc., St. Louis, MO (US);
Raj Kumar, Mission Viejo, CA (US);
Monte P. Dreyer, Rancho Santa Margarita, CA (US);
Michael J. Taylor, Longmont, CO (US);
Viasystems Technologies Corp., L.L.C., St. Louis, MO (US);
Abstract
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.