The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Dec. 26, 2012
Applicant:

Telefonaktiebolaget L M Ericsson (Publ), Stockholm, SE;

Inventors:

Chunyun Jian, Ottawa, CA;

Somsack Sychaleun, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/64 (2006.01); H03H 9/54 (2006.01); H03H 9/08 (2006.01); H03H 9/05 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01); H03H 9/60 (2006.01); H03H 9/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/6409 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/059 (2013.01); H03H 9/0514 (2013.01); H03H 9/0542 (2013.01); H03H 9/08 (2013.01); H03H 9/542 (2013.01); H03H 9/547 (2013.01); H03H 9/605 (2013.01); H03H 9/6423 (2013.01); H03H 9/6426 (2013.01); H03H 9/6483 (2013.01); H03H 2009/0019 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.


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