The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Dec. 21, 2012
Applicants:

Shimane Prefectural Government, Matsue-shi, JP;

Shimane Electronic Imafuku Works Co., Ltd., Hamada-shi, JP;

Inventors:

Satoshi Komatsubara, Matsue, JP;

Kenichi Fukuda, Matsue, JP;

Shinobu Otao, Matsue, JP;

Toru Furuta, Hamada, JP;

Assignees:

S.E.I Inc., Hamada-shi, JP;

Shimane Prefectural Government, Matsue-shi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H05K 1/02 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); F21K 99/00 (2016.01); F21Y 101/02 (2006.01); F21Y 105/00 (2016.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01); H05K 1/021 (2013.01); F21K 9/00 (2013.01); F21Y 2101/02 (2013.01); F21Y 2105/001 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/8592 (2013.01); H05K 2201/09054 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0323 (2013.01);
Abstract

Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (), a projecting portion () serving as a reflecting member is formed on a metal thin plate () to surround a semiconductor light emitting element (). The semiconductor light emitting element () is connected to a printed board () by using a wire (), for example. The projecting portion () is formed by pressing and bending the metal thin plate () from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element ().


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