The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Oct. 17, 2012
Applicants:

Tsuneo Hamaguchi, Tokyo, JP;

Yoshimi Yabugaki, Tokyo, JP;

Daisuke Echizenya, Tokyo, JP;

Jun Fujita, Tokyo, JP;

Tomoo Takayama, Tokyo, JP;

Shinsuke Miyamoto, Tokyo, JP;

Inventors:

Tsuneo Hamaguchi, Tokyo, JP;

Yoshimi Yabugaki, Tokyo, JP;

Daisuke Echizenya, Tokyo, JP;

Jun Fujita, Tokyo, JP;

Tomoo Takayama, Tokyo, JP;

Shinsuke Miyamoto, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01);
U.S. Cl.
CPC ...
H01L 31/05 (2013.01); H01L 31/0512 (2013.01); Y02E 10/50 (2013.01);
Abstract

A solar cell module in the present invention includes: a wiring member electrically connecting solar cell elements to each other; and a structure in which a solder bonding portion is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder, a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and a side surface of the solder bonding portion and a side surface of the wiring member are covered with a thermosetting resin.


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