The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Aug. 26, 2015
Applicant:

Sandisk Technologies, Inc., Plano, TX (US);

Inventors:

Atsushi Shimoda, Yokkaichi, JP;

Masayuki Fukai, Yokkaichi, JP;

Yuji Takahashi, Yokkaichi, JP;

Assignee:

SanDisk Technologies LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 27/115 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/7682 (2013.01); H01L 24/06 (2013.01); H01L 27/11519 (2013.01); H01L 27/11548 (2013.01); H01L 23/522 (2013.01); H01L 23/5222 (2013.01); H01L 27/11524 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/06051 (2013.01);
Abstract

A method of forming a semiconductor device includes forming a plurality of word lines separated by air gaps with contact pad structures connected to the word lines, and forming a dummy structure directly opposite an air gap between neighboring word lines. Subsequently, the contact pad structures are cut into individual contact pads by a contact pad cut that intersects the dummy structure.


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