The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Oct. 23, 2008
Shoji Yasunaga, Kyoto, JP;
Shoji Yasunaga, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
There is provided a resin-sealed semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in reliability. This BGA type semiconductor device includes a wiring substrate on a predetermined area on which a semiconductor chip is mounted; a plurality of metal bumps that are formed to be arranged at predetermined intervals in an area of the substrate different from the area on which the semiconductor chip is mounted; and a sealing resin layer that covers at least the semiconductor chip. Each of the plurality of metal bumps is covered with the sealing resin layer described above, with a part thereof exposed at a top face of the sealing resin layer.