The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Aug. 14, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Ryan David Lane, San Diego, CA (US);
Charles David Paynter, Encinitas, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 24/19 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/4334 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A package on package semiconductor structure includes a first package positioned above a first surface of a substrate, a second package positioned above the first package, and a first thermal element positioned between the first package and the second package, wherein the first thermal element is separated from the second package by an air gap and the thermal element provides a heat path for heat generated by the first package.