The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Jan. 11, 2014
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4878 (2013.01); H01L 23/13 (2013.01); H01L 23/14 (2013.01); H01L 23/3157 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/3107 (2013.01); H01L 23/467 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion.