The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Dec. 08, 2014
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Scott L. Gooch, San Carlos, CA (US);
Shankar S. Pennathur, San Jose, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H01L 21/56 (2006.01); B29C 45/27 (2006.01); B29C 45/76 (2006.01); B29C 45/02 (2006.01); H05K 3/00 (2006.01); B29L 31/34 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/02 (2013.01); B29C 45/14655 (2013.01); B29C 45/27 (2013.01); B29C 45/766 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H05K 3/0091 (2013.01); B29C 2945/762 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/7611 (2013.01); B29C 2945/76381 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76595 (2013.01); B29C 2945/76678 (2013.01); B29C 2945/76859 (2013.01); B29L 2031/3425 (2013.01); H05K 3/284 (2013.01); H05K 2203/1316 (2013.01);
Abstract
Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.