The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Aug. 29, 2013
Applicant:
Sunam Co., Ltd., Anseong-si, Gyeonggi-do, KR;
Inventors:
Seung Hyun Moon, Seongnam-si, KR;
Woo Suk Chung, Yongin-si, KR;
Jae Hun Lee, Osan-si, KR;
KyuHan Choi, Hwaseong-si, KR;
DeaWon Song, Ansan-si, KR;
ByeongJoo Kim, Ansan-si, KR;
SangJun Ahn, Hwaseong-si, KR;
Assignee:
SUNAM CO., LTD., Anseong-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/00 (2006.01); H01L 39/14 (2006.01); H01B 12/06 (2006.01); H01B 13/00 (2006.01); H01B 13/22 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
H01B 12/06 (2013.01); H01B 13/0016 (2013.01); H01B 13/0036 (2013.01); H01B 13/222 (2013.01); H01B 13/228 (2013.01); H01L 39/143 (2013.01); H01L 39/248 (2013.01);
Abstract
Provided is a method of manufacturing a superconducting wire. A superconducting tape having an outer surface is provided, a copper layer is formed on the outer surface of the superconducting tape, and first metal tape and second metal tape are respectively attached on a first surface and a second surface of the superconducting tape on which the copper layer is formed.