The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

May. 27, 2016
Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

John McBrien, South Glastonbury, CT (US);

Lea Kennard Castle, Vernon, CT (US);

Brandon W. Spangler, Vernon, CT (US);

JinQuan Xu, East Greenwich, RI (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22C 9/02 (2006.01); F01D 5/18 (2006.01); F01D 5/28 (2006.01); B22C 9/10 (2006.01); B22C 9/06 (2006.01); B22D 25/02 (2006.01); B22D 27/04 (2006.01); B22D 23/06 (2006.01); B22F 3/105 (2006.01); B22F 3/11 (2006.01); B22F 3/24 (2006.01); B23K 15/00 (2006.01); F23R 3/28 (2006.01); F01D 5/14 (2006.01); F01D 9/02 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
F01D 5/282 (2013.01); B22C 9/061 (2013.01); B22C 9/101 (2013.01); B22C 9/108 (2013.01); B22D 23/06 (2013.01); B22D 25/02 (2013.01); B22D 27/04 (2013.01); B22F 3/1055 (2013.01); B22F 3/11 (2013.01); B22F 3/24 (2013.01); B23K 15/0086 (2013.01); B23K 26/342 (2015.10); F01D 5/147 (2013.01); F01D 9/02 (2013.01); F23R 3/28 (2013.01); B22F 2003/248 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F05D 2230/31 (2013.01); F05D 2300/175 (2013.01); F05D 2300/211 (2013.01);
Abstract

An intermediate component with an internal passageway includes a solid metallic additively manufactured component with an internal passageway in a near finished shape. The component has voids greater than 0 percent but less than approximately 15 percent by volume and up to 15 percent additional material by volume in the near finished shape compared to a desired finished configuration. Also included are a ceramic core disposed within the internal passageway of the component and an outer ceramic shell mold encasing an entirety of the component, such that an entire external surface of the component is covered by the outer ceramic shell mold.


Find Patent Forward Citations

Loading…