The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Dec. 19, 2012
Applicant:
Smith International, Inc., Houston, TX (US);
Inventors:
Ronald K. Eyre, Orem, UT (US);
John Daniel Belnap, Lindon, UT (US);
Youhe Zhang, Spring, TX (US);
Yuelin Shen, Spring, TX (US);
Jibin Shi, Spring, TX (US);
Yuri Burhan, Spring, TX (US);
Assignee:
Smith International, Inc., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/46 (2006.01); E21B 10/56 (2006.01); B22F 3/14 (2006.01); B22F 5/00 (2006.01); B22F 7/00 (2006.01); C22C 26/00 (2006.01); C04B 35/52 (2006.01); E21B 10/567 (2006.01);
U.S. Cl.
CPC ...
E21B 10/46 (2013.01); B22F 3/14 (2013.01); B22F 5/00 (2013.01); B22F 7/008 (2013.01); C04B 35/52 (2013.01); C22C 26/00 (2013.01); E21B 10/567 (2013.01); B22F 2005/001 (2013.01);
Abstract
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.