The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Mar. 11, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Manfred Engelhardt, Villach-Landskron, AT;
Martin Zgaga, Rosegg, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/001 (2013.01); B81B 3/0051 (2013.01); B81C 1/00531 (2013.01); B81C 1/00626 (2013.01); B81C 2201/0112 (2013.01); B81C 2201/0132 (2013.01);
Abstract
According to an embodiment of a semiconductor device, the semiconductor device includes a micro-mechanical structure and a semiconductor material arranged over the micro-mechanical structure. A side surface of the semiconductor material includes a first region and a second region. The first region has an undulation, and the second region is a peripheral region of the side surface and decreases towards the micro-mechanical structure.