The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

Feb. 24, 2012
Applicants:

Kazuhiro Hatanaka, Iyo-gun, JP;

Hiroaki Sakata, Iyo-gun, JP;

Hiroshi Taiko, Otsu, JP;

Inventors:

Kazuhiro Hatanaka, Iyo-gun, JP;

Hiroaki Sakata, Iyo-gun, JP;

Hiroshi Taiko, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/14 (2006.01); B32B 37/14 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
B32B 5/145 (2013.01); B32B 5/02 (2013.01); B32B 37/14 (2013.01); C08J 5/24 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01); C08J 2400/22 (2013.01); C08J 2481/06 (2013.01); C08K 2003/0806 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24893 (2015.01);
Abstract

The present invention relates to a sheet-form prepreg which comprises a plurality of carbon fibers and a matrix resin with which the plurality of carbon fibers are impregnated. This matrix resin contains a thermosetting resin, a curing agent, conductive particles of 1 μm or smaller in diameter, conductive particles of 5 μm or larger in diameter and thermoplastic resin particles, and the conductive particles of 1 μm or smaller in diameter, the conductive particles of 5 μm or larger in diameter and the thermoplastic resin particles are each disproportionately distributed in a specific part of the prepreg. By the present invention, a prepreg from which a carbon fiber-reinforced composite material having both excellent impact resistance and good conductivity in the lamination direction can be produced is provided.


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