The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Sep. 12, 2013
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Yoshio Kawai, Hitachinaka, JP;

Hironori Ohhashi, Isesaki, JP;

Yuuichi Yanagisawa, Maebashi, JP;

Kumiko Yoshinaga, Ota, JP;

Eiji Ichikawa, Isesaki, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); H01L 23/3675 (2013.01); H05K 1/0203 (2013.01); H05K 7/20409 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat-generating component () is mounted on a surface (), on a case () side, of a circuit board (). A recessed portion () is formed in a position facing the heat-generating component (), on an inner wall surface () side of a bottom wall () of the case (). Between an inner wall surface () of this recessed portion () and the heat-generating component (), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member () is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (), on the case () side, of the circuit board () and the inner wall surface () of the bottom wall () of the case () on a peripheral edge side of the recessed portion ().


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