The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Dec. 18, 2007
Steven J. Ahladas, Highland, NY (US);
David P. Graybill, Staatsburg, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
Gerard V. Weber, Jr., Saugerties, NY (US);
Steven J. Ahladas, Highland, NY (US);
David P. Graybill, Staatsburg, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
Gerard V. Weber, Jr., Saugerties, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.