The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Oct. 04, 2013
Applicants:

Mauro P. Bidinost, El Paso, TX (US);

Hector Sanchez Rojas, Ciudad Juarez, MX;

Inventors:

Mauro P. Bidinost, El Paso, TX (US);

Hector Sanchez Rojas, Ciudad Juarez, MX;

Assignee:

INTEVA PRODUCTS, LLC, Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01); H05K 7/02 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); E05B 85/02 (2014.01); E05B 81/54 (2014.01); B29L 31/30 (2006.01); E05B 15/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); B29C 45/14639 (2013.01); B29C 45/1671 (2013.01); E05B 81/54 (2013.01); E05B 85/02 (2013.01); B29L 2031/30 (2013.01); E05B 2015/1664 (2013.01);
Abstract

A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member.


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