IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9480164 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

May. 29, 2012

Resin composition, prepreg, and laminate

Applicants:

Takaaki Ogashiwa, Tokyo, JP;

Hiroshi Takahashi, Tokyo, JP;

Tetsuro Miyahira, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Inventors:

Takaaki Ogashiwa, Tokyo, JP;

Hiroshi Takahashi, Tokyo, JP;

Tetsuro Miyahira, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Eisa Elhilo

Int. Cl.
CPC ...
B32B 27/38 (2006.01); H05K 3/00 (2006.01); C08G 73/06 (2006.01); C08L 79/04 (2006.01); C08L 79/08 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08K 5/3445 (2006.01); C08K 5/29 (2006.01); C08K 5/3415 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0061 (2013.01); B32B 5/024 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 73/0655 (2013.01); C08J 5/24 (2013.01); C08L 79/04 (2013.01); C08L 79/085 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/51 (2013.01); B32B 2457/00 (2013.01); C08J 2379/04 (2013.01); C08J 2379/08 (2013.01); C08K 5/29 (2013.01); C08K 5/3415 (2013.01); C08K 5/3445 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0355 (2013.01); Y10T 156/10 (2015.01); Y10T 428/31529 (2015.04);
Abstract

It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Find Patent Forward Citations

Loading…