The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Apr. 30, 2014
Applicants:
The Boeing Company, Chicago, IL (US);
Metis Design Corporation, Cambridge, MA (US);
Inventors:
Seth S. Kessler, Newtown, MA (US);
Jeong-Beom Ihn, Bellevue, WA (US);
Christopher T. Dunn, Salem, MA (US);
Jeffrey Lynn Duce, Milton, WA (US);
Michael G. Borgen, Wilmington, MA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 1/18 (2006.01); G06F 3/05 (2006.01); G08C 19/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); G06F 3/05 (2013.01); G08C 19/16 (2013.01); H05K 1/0219 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1344 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49169 (2015.01);
Abstract
Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.