The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Feb. 15, 2012
Applicants:

Hiroharu Inoue, Osaka, JP;

Shingo Yoshioka, Osaka, JP;

Koji Kishino, Fukushima, JP;

Takatoshi Abe, Osaka, JP;

Inventors:

Hiroharu Inoue, Osaka, JP;

Shingo Yoshioka, Osaka, JP;

Koji Kishino, Fukushima, JP;

Takatoshi Abe, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 15/08 (2006.01); H05K 1/03 (2006.01); B32B 15/14 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); H05K 1/036 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2457/08 (2013.01); H05K 1/0366 (2013.01); H05K 3/022 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/029 (2013.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01);
Abstract

A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.


Find Patent Forward Citations

Loading…