The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jul. 03, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiroshi Iwano, Osaka, JP;

Mitsuru Iida, Mie, JP;

Daisuke Sato, Mie, JP;

Hidetoshi Takeyama, Mie, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/79 (2011.01); H05K 1/11 (2006.01); H01R 12/61 (2011.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01R 12/613 (2013.01); H01R 12/79 (2013.01); H05K 1/114 (2013.01); H05K 1/11 (2013.01); H05K 1/117 (2013.01); H05K 3/0038 (2013.01); H05K 3/365 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/167 (2013.01);
Abstract

A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.


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