The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Oct. 24, 2013
Applicant:

Fujikura Ltd., Koto-ku, Tokyo, JP;

Inventor:

Kohei Matsumaru, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 3/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 3/026 (2013.01); H05K 1/025 (2013.01); H05K 1/0245 (2013.01); H05K 1/0248 (2013.01); H05K 1/0271 (2013.01); H05K 1/0274 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01);
Abstract

Provided is a wiring board including: a board; a differential transmission line constituted by two wirings disposed on the board in parallel; an insulation resin layer which is formed on part of a face of the board. A stepped portion constituted by a lateral face of the insulation resin layer is formed at a boundary between the face of the board and a top face of the insulation resin layer. The two wirings extend from the face of the board to the top face of the insulation resin layer so as to traverse the stepped portion. The extending direction of the wirings traversing the stepped portion and the direction of a periphery are perpendicular to each other in a plan view of the board, the periphery being defined by a boundary between the top face of the insulation resin layer and the lateral face of the insulation resin layer.


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