The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Nov. 22, 2012
Applicant:
Nexcis, Rousset, FR;
Inventors:
Stephanie Angle, Rousset, FR;
Ludovic Parissi, Rousset, FR;
Assignee:
NEXCIS, Rousset, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/04 (2014.01); H01L 31/0749 (2012.01); H01L 31/0296 (2006.01); H01L 21/02 (2006.01); H01L 31/032 (2006.01); H01L 31/0392 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1864 (2013.01); H01L 21/02491 (2013.01); H01L 21/02568 (2013.01); H01L 21/02614 (2013.01); H01L 21/02658 (2013.01); H01L 31/0296 (2013.01); H01L 31/022425 (2013.01); H01L 31/0322 (2013.01); H01L 31/0392 (2013.01); H01L 31/0749 (2013.01); H01L 31/03928 (2013.01); Y02E 10/541 (2013.01); Y02P 70/521 (2015.11);
Abstract
The invention relates to a method of manufacturing a I-III-VIlayer with photovoltaic properties, comprising: The element VI usually diffuses into the contact layer (MO) during the heat treatment and combines with the metal to form a superficial layer (SUP) on the contact layer. In the method of the invention, the metal deposition comprises a step during which an additional element is added to the metal to form a compound (MO-EA), in the contact layer, acting as a barrier to the diffusion of the element VI, which allows precisely controlling the properties of the superficial layer, particularly its thickness.