The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jun. 23, 2011
Applicants:

Masao Kirihara, Osaka, JP;

Hiroshi Yamanaka, Mie, JP;

Yoshiharu Sanagawa, Osaka, JP;

Takanori Aketa, Osaka, JP;

Yushi Nakamura, Mie, JP;

Mitsuhiko Ueda, Osaka, JP;

Inventors:

Masao Kirihara, Osaka, JP;

Hiroshi Yamanaka, Mie, JP;

Yoshiharu Sanagawa, Osaka, JP;

Takanori Aketa, Osaka, JP;

Yushi Nakamura, Mie, JP;

Mitsuhiko Ueda, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 31/024 (2014.01); G01J 5/04 (2006.01); G01J 5/06 (2006.01); G01J 5/08 (2006.01); G01J 5/12 (2006.01);
U.S. Cl.
CPC ...
H01L 31/024 (2013.01); G01J 5/04 (2013.01); G01J 5/045 (2013.01); G01J 5/06 (2013.01); G01J 5/08 (2013.01); G01J 5/0806 (2013.01); G01J 5/0831 (2013.01); G01J 5/12 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.


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