The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Dec. 30, 2014
Applicant:

Integrated Device Technology, Inc., San Jose, CA (US);

Inventors:

Robert A. Gubser, Arlington, WA (US);

Ajay Kumar Ghai, San Jose, CA (US);

Viresh Piyush Patel, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 49/02 (2006.01); H01L 23/50 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/552 (2013.01);
Abstract

An integrated circuit device includes an integrated circuit substrate having an at least two piece package thereon. The package has a sealed cavity therein and a patterned metal inductor in the cavity. The inductor has at least a first terminal electrically coupled to a portion of the integrated circuit substrate by an electrically conductive via, which extends at least partially through the package. The package, which may include a material selected from a group consisting of glass and ceramics, includes a base and a cap sealed to the base. The metal inductor includes a metal layer patterned on at least one of the cap and base of the package. The base may also include first and second electrically conductive vias therein, which are electrically connected to first and second terminals of the inductor.


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