The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jul. 24, 2015
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Jerome Mitard, Bossut-Gottechain, BE;

Roger Loo, Leuven, BE;

Liesbeth Witters, Linden, BE;

Assignee:

IMEC vzw, Leuven, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 21/02 (2006.01); H01L 29/165 (2006.01); H01L 29/78 (2006.01); H01L 21/8238 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 21/0245 (2013.01); H01L 21/02381 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/02609 (2013.01); H01L 21/02645 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/165 (2013.01); H01L 29/7848 (2013.01); H01L 29/045 (2013.01);
Abstract

The disclosed technology generally relates to complementary metal-oxide-silicon (CMOS) devices, and more particularly to a transistor device comprising a germanium channel layer, such as an n-channel metal-oxide-silicon (NMOS) transistor device. In one aspect, a method of forming a germanium channel layer for an NMOS transistor device comprises providing a trench having sidewalls defined by a dielectric material structure and abutting on a silicon substrate's surface, and growing a seed layer in the trench on the surface, where the seed layer has a front surface comprising facets having a (111) orientation. The method additionally includes growing a strain-relaxed buffer layer in the trench on the seed layer, where the strain-relaxed buffer layer comprises silicon germanium. The method further includes growing a channel layer comprising germanium (Ge) on the strain-relaxed buffer layer. In other aspects, devices, e.g., an NMOS transistor device and a CMOS device, includes features fabricated using the method.


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