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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9478503 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Feb. 28, 2013

Integrated device

Applicants:

Mitsutoshi Makihata, Sendai, JP;

Masayoshi Esashi, Sendai, JP;

Shuji Tanaka, Sendai, JP;

Masanori Muroyama, Sendai, JP;

Hirofumi Funabashi, Nagoya, JP;

Yutaka Nonomura, Nagoya, JP;

Yoshiyuki Hata, Nagoya, JP;

Hitoshi Yamada, Aichi-gun, JP;

Takahiro Nakayama, Nagoya, JP;

Ui Yamaguchi, Toyota, JP;

Inventors:

Mitsutoshi Makihata, Sendai, JP;

Masayoshi Esashi, Sendai, JP;

Shuji Tanaka, Sendai, JP;

Masanori Muroyama, Sendai, JP;

Hirofumi Funabashi, Nagoya, JP;

Yutaka Nonomura, Nagoya, JP;

Yoshiyuki Hata, Nagoya, JP;

Hitoshi Yamada, Aichi-gun, JP;

Takahiro Nakayama, Nagoya, JP;

Ui Yamaguchi, Toyota, JP;

Assignees:

TOHOKU UNIVERSITY, Sendai-Shi, JP;

KABUSHIKI KAISHA TOYOTA CHUO-KENKYUSHO, Nagakute-Shi, JP;

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-Shi, JP;

Attorney:

Kenyon & Kenyon LLP

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/538 (2006.01); B81B 7/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/306 (2006.01); H01L 25/18 (2006.01); H01L 27/06 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); B81C 1/00 (2006.01); H01L 25/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); B81B 7/008 (2013.01); B81C 1/00238 (2013.01); H01L 21/30625 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/5386 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 27/0611 (2013.01); B81C 2203/0792 (2013.01); H01L 25/50 (2013.01); H01L 29/0657 (2013.01); H01L 2221/68327 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

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