The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Jan. 31, 2014
Applicant:
Altera Corporation, San Jose, CA (US);
Inventors:
Jianmin Zhang, Los Gatos, CA (US);
Myung June Lee, Cupertino, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/18 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76879 (2013.01);
Abstract
Integrated circuit packages with openings surrounding a conductive via on a substrate layer are disclosed. An integrated circuit package may include a substrate layer with upper and lower surfaces. A conductive via may extend between the upper and lower surfaces of the substrate layer. The integrated circuit package further includes multiple openings in the substrate layer that may be distributed evenly in the substrate layer surrounding the conductive via. The multiple openings reduce signal insertion loss of the conductive via.