The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jun. 12, 2015
Applicants:

Alan Hiroshi Ouye, San Mateo, CA (US);

Alexander N. Lerner, San Jose, CA (US);

Inventors:

Alan Hiroshi Ouye, San Mateo, CA (US);

Alexander N. Lerner, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01J 37/32009 (2013.01); H01J 37/32642 (2013.01); H01L 21/3065 (2013.01); H01L 21/67098 (2013.01); H01L 21/78 (2013.01);
Abstract

Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a shadow ring assembly for a plasma processing chamber includes an annular body including a thermally conductive material. The annular body includes a top surface to face an interior of the plasma chamber, and a bottom surface to face a substrate carrier in the plasma chamber. A plurality of posts are attached to the annular body and positioned substantially below the bottom surface of the annular body. Each of the plurality of posts includes an inner core of thermal pyrolytic graphite (TPG). The shadow ring assembly also includes a plasma resistant coating on the annular body and the plurality of posts.


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