The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Feb. 13, 2015
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Tomoya Yokoyama, Kyoto, JP;

Koki Nishimura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01Q 7/00 (2006.01); H04B 5/00 (2006.01); H01Q 1/40 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0033 (2013.01); H01Q 1/40 (2013.01); H01Q 7/00 (2013.01); H04B 5/0075 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01);
Abstract

Line conductors are provided on one principal surface of a magnetic layer, and line conductors are provided on the other principal surface of the magnetic layer. In addition, side conductors are provided on side surfaces of the magnetic layer to connect the line conductors in a coil shape. A non-magnetic layer is stacked at the one principal surface side of the magnetic layer, and a non-magnetic layer is stacked at the other principal surface side of the magnetic layer. Line conductors are provided within the non-magnetic layer, and line conductors are provided within the non-magnetic layer. Via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors. In addition, via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors.


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