The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jul. 21, 2014
Applicants:

Takashi Shinmoto, Noda, JP;

Shotaro Yoshida, Edogawa-ku, JP;

Shinji Katayama, Numazu, JP;

Taikou Toda, Hamamatsu, JP;

Takamasa Kato, Chiba, JP;

Masanori Daibo, Sakura, JP;

Akio Kawakawi, Numazu, JP;

Inventors:

Takashi Shinmoto, Noda, JP;

Shotaro Yoshida, Edogawa-ku, JP;

Shinji Katayama, Numazu, JP;

Taikou Toda, Hamamatsu, JP;

Takamasa Kato, Chiba, JP;

Masanori Daibo, Sakura, JP;

Akio Kawakawi, Numazu, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 1/00 (2006.01); B23K 20/00 (2006.01); B21C 3/04 (2006.01); H01B 1/02 (2006.01); H01B 7/30 (2006.01); B23K 20/233 (2006.01); C22C 21/00 (2006.01); B32B 15/01 (2006.01); H01B 5/02 (2006.01); H01B 13/00 (2006.01); C22C 9/00 (2006.01); C23C 28/02 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0006 (2013.01); B21C 3/04 (2013.01); B23K 20/001 (2013.01); B23K 20/2333 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); C22C 21/00 (2013.01); C23C 28/023 (2013.01); H01B 1/023 (2013.01); H01B 1/026 (2013.01); H01B 5/02 (2013.01); H01B 7/30 (2013.01); H01F 27/2823 (2013.01); B21C 1/003 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method for manufacturing a high frequency cable that includes covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer.


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