The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Sep. 14, 2012
Applicants:

Min-su Chang, Incheon, KR;

Soon-ho Han, Gyeonggi-do, KR;

Duck-yong Lee, Gyeonggi-do, KR;

Inventors:

Min-Su Chang, Incheon, KR;

Soon-Ho Han, Gyeonggi-do, KR;

Duck-Yong Lee, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/00 (2006.01); G06F 1/16 (2006.01); B29L 31/34 (2006.01); B29L 31/44 (2006.01); B29C 45/27 (2006.01); B29C 45/00 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1643 (2013.01); B29C 45/2708 (2013.01); B29C 2045/0027 (2013.01); B29L 2031/3437 (2013.01); B29L 2031/445 (2013.01); G06F 3/0412 (2013.01); G06F 2203/04103 (2013.01); Y10T 428/24488 (2015.01);
Abstract

Provided are a window member for a display device of a portable terminal and a method for fabricating the window member. An inner surface of the window member is formed as a flat surface from a first end portion to a position adjacent to a second end portion, and an inner surface of the second end portion is formed inclined with respect to the flat surface in a direction toward an outer surface. According to the window member and the method for fabricating the same, shrinkage is minimized during hardening of melt resin by sufficiently delivering injection pressure for the melt resin over the entire molding space of a mold, thereby improving a product defect rate.


Find Patent Forward Citations

Loading…