The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Apr. 10, 2014
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Rodney S. Ruoff, Austin, TX (US);

Iskandar Kholmanov, Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/15 (2006.01); G02F 1/03 (2006.01); G09G 3/19 (2006.01); G09G 3/38 (2006.01); G02F 1/155 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1506 (2013.01); G02F 1/155 (2013.01); G02F 2202/36 (2013.01); Y10T 428/12056 (2015.01); Y10T 428/31678 (2015.04);
Abstract

A hybrid transparent conductive film, and methods for fabricating such hybrid transparent conductive films, involving the assembly of two-dimensional graphene-based materials with one-dimensional silver and/or copper nanowires with high optical transmittance and good electrical conductivity. The hybrid films are characterized by a good degree of control of the architecture at the nanoscale level, where the weakness(es) of each component are offset by the strengths of the other components. By rational design of the structure and using simple and locate-cost fabrication methods, hybrid films with sheet resistance of 26 ohm/sq and optical transmittance (at λ=550 nm) of 83% for reduced graphene oxide/silver nanowire films, and 64 ohm/sq and optical transmittance of 93.6% for monolayer graphene/silver nanowire films have been fabricated. These values are comparable to transparent conductive films based on indium tin oxide but are now able to be used in flexible electronics due to their good mechanical properties.


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