The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9475234 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 25, 2016

Filed:

Aug. 21, 2012
Applicant:

Hiroaki Morikawa, Kanagawa, JP;

Inventor:

Hiroaki Morikawa, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0077 (2013.01); B29C 67/0096 (2013.01);
Abstract

A powder removing apparatus includes a box, a stage moving mechanism, and a powder removing processing mechanism. The box has a main body with an opening and a stage movably provided in the main body. The box is capable of accommodating a molded object and non-bonding powder so as to arrange the molded object, which is formed using powder according to a rapid prototyping technique, on the stage together with the non-bonding powder. The stage moving mechanism is capable of moving the stage upward relative to the main body inside the main body. The powder removing processing mechanism is configured to remove the non-bonding powder existing around the molded object extruded by a driving operation of the stage moving mechanism via the opening.


Find Patent Forward Citations

Morikawa, Hiroaki. (2016). Powder removing apparatus, molding system, and method of manufacturing molded object (U.S. Patent No. 9475234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9475234

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