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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9475229 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Jul. 17, 2013

Resin production method and resin production apparatus

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kenichi Iida, Kawasaki, JP;

Toshiki Ito, Kawasaki, JP;

Naoko Matsufuji, Yokohama, JP;

Tatsuya Suzuki, Kawasaki, JP;

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Fitzpatrick, Cella, Harper & Scinto

Primary Examiner:

Dah-Wei D Yuan

Assistant Examiner:

Kristen A Dagenais

Int. Cl.
CPC ...
B29C 59/02 (2006.01); G03F 7/00 (2006.01); G03F 7/027 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); G03F 7/0002 (2013.01); G03F 7/027 (2013.01); B29K 2105/0002 (2013.01);
Abstract

Provided is a resin production method in which a mold release force applied between a mold and a curable resin is reduced in a resin production method using a nano-imprint method. The resin production method includes an arrangement step of arranging a curable composition () on a substrate (); a contacting step of bringing a mold () into contact with the curable composition (); a curable composition curing step of curing the curable composition () by irradiating the curable composition () with a radiation or heating the curable composition () while keeping the curable composition () in contact with the mold (); a tensile stress generation step of generating a tensile stress () in a direction of spacing the substrate () and the mold () away from each other to such a degree that the mold () and the curable composition () are not spaced away from each other when the curable composition () is cured; and a mold release step of releasing the curable composition () and the mold () from each other.

Find Patent Forward Citations

Iida, Kenichi. (2016). Resin production method and resin production apparatus (U.S. Patent No. 9475229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9475229

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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