The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Mar. 04, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroaki Tachibana, Osaka, JP;

Koji Tsuji, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 19/00 (2006.01); B01L 7/00 (2006.01); F24J 1/00 (2006.01); F28D 7/00 (2006.01); B01L 3/00 (2006.01); C12M 1/26 (2006.01); F28D 3/00 (2006.01); F28D 5/00 (2006.01); C12M 3/00 (2006.01); H01L 23/473 (2006.01); B01J 19/24 (2006.01); B01J 37/02 (2006.01);
U.S. Cl.
CPC ...
B01L 7/525 (2013.01); B01J 19/0093 (2013.01); B01L 3/5027 (2013.01); B01L 3/502715 (2013.01); C12M 33/00 (2013.01); B01J 19/2485 (2013.01); B01J 37/0228 (2013.01); B01J 2219/00081 (2013.01); B01J 2219/00783 (2013.01); B01J 2219/00822 (2013.01); B01J 2219/00873 (2013.01); B01J 2219/00876 (2013.01); B01J 2219/00885 (2013.01); B01L 2300/087 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0883 (2013.01); B01L 2300/1827 (2013.01);
Abstract

The present invention provides a miniaturized microfluidic device with a heater that has a simple structure without needing adhesion means for improving the heat transfer between the heater block and the device, and which can form the uniform temperature regions. Disclosed is a microfluidic device, including: a substrate; a reaction flow path formed on the substrate; and a temperature adjustment heater for heating the reaction flow path, in which a reaction flow path formation region including the reaction flow path formed therein and a temperature adjustment heater formation region including the temperature adjustment heater formed therein are alternately arranged on the substrate, the reaction flow path is formed to be bent at least one time in the reaction flow path formation region, and the temperature adjustment heater is formed to be bent at least one time in the temperature adjustment heater formation region.


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