The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Feb. 14, 2011
Applicants:
Edward S. Boyden, Chestnut Hill, MA (US);
Roy P. Diaz, Seattle, WA (US);
Roderick A. Hyde, Redmond, WA (US);
Jordin T. Kare, Seattle, WA (US);
Elizabeth A. Sweeney, Seattle, WA (US);
Lowell L. Wood, Jr., Bellevue, WA (US);
Inventors:
Edward S. Boyden, Chestnut Hill, MA (US);
Roy P. Diaz, Seattle, WA (US);
Roderick A. Hyde, Redmond, WA (US);
Jordin T. Kare, Seattle, WA (US);
Elizabeth A. Sweeney, Seattle, WA (US);
Lowell L. Wood, Jr., Bellevue, WA (US);
Assignee:
GEARBOX, LLC, Bellevue, WA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61L 2/00 (2006.01); A61L 29/08 (2006.01); A61L 2/232 (2006.01); A61L 2/24 (2006.01); A61L 2/26 (2006.01); A61L 27/54 (2006.01); A61L 31/08 (2006.01); A61L 17/14 (2006.01); A61L 27/28 (2006.01); A61L 27/30 (2006.01); A61L 29/00 (2006.01); A61L 29/16 (2006.01); B82Y 5/00 (2011.01); B82Y 30/00 (2011.01); A61L 2/08 (2006.01); A61L 2/14 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
A61L 29/08 (2013.01); A61L 2/0011 (2013.01); A61L 2/08 (2013.01); A61L 2/14 (2013.01); A61L 2/232 (2013.01); A61L 2/24 (2013.01); A61L 2/26 (2013.01); A61L 17/145 (2013.01); A61L 27/28 (2013.01); A61L 27/306 (2013.01); A61L 27/54 (2013.01); A61L 29/00 (2013.01); A61L 29/16 (2013.01); A61L 31/08 (2013.01); B82Y 5/00 (2013.01); B82Y 30/00 (2013.01); A61L 2300/606 (2013.01); B82Y 40/00 (2013.01);
Abstract
Systems, devices, methods, and compositions are described for providing an actively controllable implant configured to, for example, monitor, treat, or prevent microbial growth or adherence to the implant.